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							OXYGEN FREE BALL
							
      
 

      

       
      

      PRODUCT OVERVIEW：
      

       
      

      High-purity oxygen-free copper, an electroplated copper anode material with more than 99.99% of typical copper plus silver content. The product is mainly used in the field of horizontal electroplating copper manufacturing of HDI boards. Oxygen-free copper is processed by professional vacuum refining technology, the oxygen content is less than 10ppm, and the grain structure is fine. It has the advantages of stable plating uniformity. Without anode film (Phosphor copper film), production efficiency can be greatly improved, and maintenance costs can be reduced as well.